Reduced pain, easier
application and removal from gunky wounds for greater nursing
efficiency emanate from Xennovate's EverLift
RemovEZ + PULL-TAB
technology
Life for caregivers just got better because they can now remove sticky gooey dressings without pain and with little or no residuals left in the wound bed. New Xennovate adhesive technology reduces the force required to remove medical adhesives such as hydrocolloid dressings from the skin by over 30% for the standard thickness 30 mils [0.68 mm] Xennovate hydrocolloid wound dressings, thus minimizing the risk of pain or skin tearing. Repeated applications of medical adhesives on sensitive skin can cause discomfort and skin damage.
Xennovate's EverLift RemovEZ technology delivers “skin friendly” benefits such as virtually pain free removal. In addition the EverLift laminate enables a new PULL-TAB for caregivers to more easily
remove the paper release liner when
applying the hydrocolloid wound dressing and, even better, more
easily get a gloved finger under the corner of the wound dressing
after having been in place for several days, thereby saving time
and patient pain during the removal and replacement process.
Dr. David Smith, Xennovate's founder, comments, “We are proud to introduce this exciting new technology for the benefit of patients with severe wounds and ostomy products users everywhere. Ostomy products manufacturers and marketers have demonstrated an enthusiastic response to our thinner, integrated hydrocolloids and combined with our integrated hydrocolloid, Xen18, our customers now have a truly innovative and skin safe alternative for better management of skin surfaces. Additionally, in this age of MRSA, our integrated PULL-TAB reduces the risk of nosocomial infection in the clinic or home, not to mention non-reimbursable iatrogenic outcomes in the clinic.”
“Moist wound care has become the standard for treatment of most wounds,” according to a study published in Dermatological Surgery in 1995.
The same journal article indicated,
“Occlusive dressings increase re-epithelialization rates by
up to 50% and increase collagen synthesis by up to 60%.”
Today it is generally accepted by clinicians that hydrocolloids
inherently create an acidic, warm, and airtight wound environment
that heal wounds faster than non-occlusive dressings. Now with
Xen18's innovative hydrocolloid technology that does not
disintegrate in solution,
combined with RemovEZ +
PULL-TAB,
Xennovate Medical has virtually
eliminated the risks of damaging new skin upon removal of the
dressings.
Life for caregivers just got better because they can now remove sticky gooey dressings without pain and with little or no residuals left in the wound bed. New Xennovate adhesive technology reduces the force required to remove medical adhesives such as hydrocolloid dressings from the skin by over 30% for the standard thickness 30 mils [0.68 mm] Xennovate hydrocolloid wound dressings, thus minimizing the risk of pain or skin tearing. Repeated applications of medical adhesives on sensitive skin can cause discomfort and skin damage.
Xennovate's EverLift RemovEZ technology delivers “skin friendly” benefits such as virtually pain free removal. In addition the EverLift laminate enables a new PULL-TAB for caregivers to more easily

Dr. David Smith, Xennovate's founder, comments, “We are proud to introduce this exciting new technology for the benefit of patients with severe wounds and ostomy products users everywhere. Ostomy products manufacturers and marketers have demonstrated an enthusiastic response to our thinner, integrated hydrocolloids and combined with our integrated hydrocolloid, Xen18, our customers now have a truly innovative and skin safe alternative for better management of skin surfaces. Additionally, in this age of MRSA, our integrated PULL-TAB reduces the risk of nosocomial infection in the clinic or home, not to mention non-reimbursable iatrogenic outcomes in the clinic.”
“Moist wound care has become the standard for treatment of most wounds,” according to a study published in Dermatological Surgery in 1995.



